HEG members attended the 13th Asian Thermophysical Properties Conference (ATPC2022)


The 13th Asian Thermophysical Properties Conference (ATPC2022) was help online on September 26-30. On the conference, Lei Yang orally presented significant anharmonicity of thermal transport in amorphous silica at high temperature; Yuanbin Liu presented graph attention neural networks for materials and molecules; Guang Yang presented a 3-sensor 3ω-2ω method for simultaneous measurement of thermal conductivity of film & substrate and thermal boundary resistance in solid heterostructures; and Yang Shen presented effective spreading thermal conductivity of wide bandgap semiconductors in ballistic-diffusive regime.

Back to News                                              Back to Top
Previous: Our review on Bonding-enhanced interfacial thermal transport-Mechanisms, materials and applications was published on Advanced Materials Interface
  Next:     The workshop on thermal managements of electronics between HEG and LENOVO was held