Thermal Transport Across Interfaces and Surfaces with Applications in Conduction and Phase-Change Heat Transfer: From Microscale to Macroscale

Thermal transport across interfaces and surfaces is critical for thermal management design in microelectronics and cooling technologies based on phase-change heat transfer. On one hand, interfacial thermal transport becomes one of the major bottlenecks to the continued scaling of microelectronics for the next generation and beyond as microelectronics become increasingly smaller with higher power density. On the other hand, phase-change heat transfer on surfaces is the key in many cooling strategies for power electronics, cryogenic storage, and production industries.

Recently, many investigations on heat transfer across interfaces and surfaces have benefited the improvements in thermal science such as boosting the boiling heat transfer using surface functionalization and quantification of anharmonic scatterings at interfaces. In view of these achievements, this special issue is devoted to publishing outstanding works presenting novel modeling or experimental measurements in the field of heat transfer across interfaces and surfaces.

Guest editors:

Yanguang Zhou

The Hong Kong University of Science and Technology, Hong Kong, Hong Kong

Bingyang Cao

Tsinghua University, Beijing, China

Manuscript submission information:

Manuscript submission deadline: 31 July 2024