Our paper "A comprehensive review on microchannel heat sinks for electronics cooling" was published on International Journal of Extreme Manufacturing | 
    |
| Published on 2024-1-14 | |
	Our review paper "A comprehensive review on microchannel heat sinks for electronics cooling" was published on International Journal of Extreme Manufacturing [Z.Q. Yu, M.T. Li, B.Y. Cao. A comprehensive review on microchannel heat sinks for electronics cooling. International Journal of Extreme Manufacturing, 2024, 6: 022005].
  | 
    ||
Back to News Back to Top  | 
    ||
| Previous: The meeting on thermal managements of electronics between HEG and Xiaomi was held | ||
| Next: Meeting on thermal modelling in EDA between Empyrean and HEG was held | ||