An integrated multi-scale structured heat sink for the efficient heat dissipation of two-phase immersion-cooled chips. Thermal Science and Engineering Progress
B. Li, L. Pan, A.Q. Liu, J.Y. Hao, B.Y. Cao. An integrated multi-scale structured heat sink for the efficient heat dissipation of two-phase immersion-cooled chips. Thermal Science and Engineering Progress, 2026, 70: 104459.
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